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PULSED LASER DEPOSITION (PLD) SYSTEM 
[LAMBDA PHYSIK (COMPexPro-201) Excimer laser]

Laser Wave length: 248nm

Active gas-KrF; Medium-He

Maximum Pulse energy: 700mJ

Repetition rate: 10Hz

Pulse duration: 25ns

 

Pulsed laser deposition (PLD) is a thin film deposition technique where a high power pulsed laser beam (LAMBDA PHYSIK (COMPexPro-201) Excimer laser) is focused inside a vacuum chamber to strike a target of the desired composition. Material is then vaporized from the target and deposited as a thin film on a substrate. This process can occur in ultra-high vacuum (~ 10-7 torr). PLD is applicable to almost any material; in particular, to compounds that are difficult or impossible to produce in thin-film form by other techniques. Semiconductor thin films, Dielectric thin films, Metallic thin films, Insulator thin films and High temperature Superconducting thin films can be deposited.

 

PLD unit in our Laboratory has Substrate Heater (max. temp-850o C) and six Target Holders for multilayer coatings. Good stoichiometric transfer between target and the deposited film, High deposition rate (~ 0.1nm/s), Epitaxial layer growth and Good adhesion at relatively low temperatures can be maintained easily.

 

Advantages of PLD: · Good stoichiometric transfer between target and the deposited film · High deposition rate (~ 0.1nm/s) · Epitaxial layer growth · Good adhesion at relatively low temperatures

 

Applications of PLD: In the deposition of · Semiconductor thin films · Dielectric thin films · Metallic thin films · Insulator thin films · High temperature Superconducting thin films

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